! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
C02E.pdf
Sep.25,2013
Top & Bottom Electrode Type for Bonding
GMA Series
This capacitor is suitable for wire bonding mounting by the external electrodes of
Au plating.
Mounting in IC packages is also possible with the upper/lower electrode structure!
Features
1
Allows for high density mounting.
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved
with a built-in capacitor in a package, such as IC. Miniaturizzation of the set is also possible.
Internal Electrodes: Ni
Ceramic
Au plated layer
GMA
Bare Chip
<Example of Structure>
Ni plated layer
Foundation Electrode Layer
Vcc Line
Ground Line
<Mounting Example>
2
3
Ideal for bypass applications.
Achieved small size and large capacity with a multilayer structure.
Excellent in high frequency characteristics.
Since the capacitor consists of an upper/lower electrode structure, the current path becomes shorter and lowers
the ESL. Compared with the general purpose GRM series of the same capacity, the impedance of this product
becomes lower at high frequencies.
100
Upper/Lower Electrode Product GMA Series
For General Purpose GRM Series
10
1
0.1
0.01
10
100
1000
Frequency (MHz)
<Comparison between Impedance - Frequency Characteristics>
Specifications
Size
Rated Voltage
Capacitance
Main Applications
0.38×0.38mm to 0.8×0.8mm
DC6.3V to 100V
100pF to 0.47μF
1. Optical communication related equipment
2. Various device related, such as GaAsIC (mounted in IC packages)
W
L
<Dimensions>
T
3. Measuring instruments, other ultra compact/thin devices
This catalog contains only a portion of the product lineup.
Please refer to the capacitor search tool on the Murata Web site for details.
105
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